Why security is important to the chiplet supply chain. Synopsys' 3DIC Compiler platform, enhanced by AI optimizations, handles multi-die and advanced chiplet packaging co-design and optimization for 2 ...
Two architects of modern computing join Lemurian Labs to help build AI infrastructure from the ground up SANTA CLARA, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Lemurian Labs today announced the ...
AI is beginning to make inroads into designing and managing programmable logic, where it can be used to simplify and speed up portions of the design process. FPGAs and DSPs are st ...
Renesas 365 directly addresses such challenges by connecting previously isolated tools such as embedded software files, datasheets and application notes into a streamlined, cloud-managed platform.
First open end-to-end electronics development platform unites device exploration, model-based system development, device lifecycle management and early concept validation in one unified cloud ...
Power and thermal become primary design considerations, not just optimizations. Hardware architectures need to be developed from the ground up. Hardware/software/model co-development is essential.
Today at Embedded World, Gateworks and NXP are announcing The GW16168 AI acceleration card. Using and deploying your own AI is a ...
The next major release, .NET 11, should arrive in November 2026, and the project recently unveiled its first public preview. Like earlier first looks, it’s nowhere near feature complete, with several ...
The government-led artificial intelligence (AI) foundation model project is intensifying its race as the four consortia in ...
Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified ...
Meta is advancing its AI infrastructure with the Meta Training and Inference Accelerator (MTIA), a family of custom-built silicon chips designed for efficient AI workloads. First developed in 2023, ...