Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Traditional verification methods are proving inadequate for addressing critical reliability challenges in today’s increasingly complex integrated circuit (IC) designs. Modern IC design requires a ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is ...
Fujitsu Semiconductor America, Inc. leads the industry in innovation. Specifically, Fujitsu provides high-quality, reliable semiconductor products and services for the wireless, automotive, consumer, ...
November 18, 2012. Coventor Inc., a supplier of design-automation software for developing micro-electromechanical systems (MEMS), has introduced the MEMS+ 3.0 design platform, the latest version of ...
China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation EDA solution ...
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