Even from the very earliest days of the automobile age, cars and trucks have been hybrids of mechanical and electrical design. For every piston sliding up and down in a cylinder, there’s a spark plug ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...