From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for advanced semiconductor applications.

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

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The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...