The micro/nano metal pattern formation is a key step in the assembly of various devices. However, ex situ approaches of metal patterning limited their industrial applications due to the poor stability ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

Stripes, curved fibres, dot arrays and some exotic stripe-dot hybrids on the surface of a frozen liquid metal. (Courtesy: K Kalantar-Zadeh) Highly ordered nanopatterns spontaneously form on the ...

Self-aligned lithographic process techniques are playing an increasingly important role in advanced technology nodes. Even with the growing use of extreme ultraviolet (EUV) lithography, ...