BEIJING, Dec. 26, 2024 /PRNewswire/ -- WiMi Hologram Cloud Inc. (WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced the ...
SEOUL, Feb. 26 (Yonhap) -- SK hynix Inc. said Thursday it has joined hands with U.S. computer technology firm Sandisk Corp. to begin standardizing next-generation memory technology known as high ...
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MRAM: the future of computer memory finally here? ⚡
A major breakthrough in the field of computer memory has just been achieved by Japanese researchers. They have developed a new universal memory technology, surpassing current computer modules in speed ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
TL;DR: Intel partners with SoftBank's SAIMEMORY to advance next-generation DRAM bonding technology using Z-Angle Memory (ZAM), enabling higher capacity, lower power consumption, and improved ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM capacity remains concentrated among Samsung, SK Hynix, and Micron. Save my ...
SoftBank unit Saimemory and Intel team up on new memory tech aimed at AI and high-performance computing. Prototypes are planned for 2028, with commercialization targeted for fiscal 2029. Energy ...
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