As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

Inspecting and testing physical evidence is useful, if not necessary, in many product liability cases that involve direct evidence of a specific product defect. From simple to complex cases, a product ...

Printed-circuit-board quality challenges extend from design through production test and inspection and on to field diagnostics. Meny Gantz, VP of marketing for Orbotech’s PCB division, cited some key ...