New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

At embedded world 2026 on the DigiKey booth, Lucy Barnard spoke with Ravindra Singh, Product Manager for Radio Modules and ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...