The engineers and researchers highlighted in COMSOL News 2026 use COMSOL Multiphysics® to meet their development goals, push ...

The COMSOL Conference 2026 Cambridge is fast approaching, with key dates coming up quickly. The f inal abstract submission ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...

BURLINGTON, MA, April 17, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, announced the program for its COMSOL Day: Simulation Apps & Digital Twins event ...

BURLINGTON, Mass., Nov. 19, 2024 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.3, which delivers new ...

The deadline to submit your abstract for the COMSOL Conference 2026 Cambridge is 10 July – don't miss your opportunity to ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

COMSOL is getting ready for some big changes -- marked by the release of Multiphysics software version 5.0, which features product updates, three new add-on products, and the "new and revolutionary" ...

COMSOL has announced the release of COMSOL Multiphysics version 5.2 providing the simulation community the only fully integrated environment for creating simulation apps. This version of COMSOL ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

Thermal management factors in to the design of all electronic devices. When it comes to the thermal management of devices, engineering objectives primarily involve efficiency, safety, reliability, ...